The relative displacement between the front and retral loading location is emphasized.

着重研究了前后油缸的相对位移。

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试的方法对肖特基器件后部的压焊工艺进行了参数优化设计。