Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂基体,间苯胺基苯甲烷低融点混合化剂,铜粉导电填料,制备了热化各向同性导电胶。