A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊过程中,因BGA锡球内孔隙有气体溢出而形成吹孔.
A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.
在迴焊过程中,因BGA锡球内孔隙有气体溢出而形成吹孔.
Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.
图5，锡高转
率与孔面积比率及它对回流峰
面度影响。
Swallows will return after leaving;Willows will regreen after withering; Peachs will reflower after falling.But ,tell me ,you smart,why our days going without coming back.
燕子去了，有再来
；
柳枯了，有再青；桃花谢了，有再开；但是，聪明，你告诉我，为什么我们日子一去不复返呢？
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