reflow

1.A blowhole will form as a result of an out-gasing of a void in the BGA sphere during the reflow process.

在迴焊过程中,因BGA锡球内孔隙有气体溢出而形成吹孔.

2.Figure 5. Transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co-planarity.

图5，锡高转率与孔面积比率及它对回流峰面度影响。

3.Swallows will return after leaving;Willows will regreen after withering; Peachs will reflower after falling.But ,tell me ,you smart,why our days going without coming back.

燕子去了，有再来；柳枯了，有再青；桃花谢了，有再开；但是，聪明，你告诉我，为什么我们日子一去不复返呢？