A. Gurav, B. Stacy, Whiskering Evaluation of Capacitors Mounted with Lead Free Solders, IPC/JEDEC 5th International Conference on Lead Free Electronic Components and Assemblies, March 2004.
吴懿平,刘一波,吴丰顺,集成电路引脚无铅覆层的锡须
制,自然科学基金项目申请书,2004.
A. Gurav, B. Stacy, Whiskering Evaluation of Capacitors Mounted with Lead Free Solders, IPC/JEDEC 5th International Conference on Lead Free Electronic Components and Assemblies, March 2004.
吴懿平,刘一波,吴丰顺,集成电路引脚无铅覆层的锡须制,自然科学基金项目申请书,2004.
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