1.The main rason of leading to overhigh hydrogen content was insufficient anneal after forged.
导致氢含量过高的原因可能在于锻后退。
2.The resistivity and flexivity of the resistance thermostat metal change while the anneal process change.
当退工艺变化时,电阻系列热双属的电阻率和温曲率等主要性能将产生变化。
3.It also suggests some ways to improve the techniques of acid cleaning, bonderizing, annealing and deformation.
并提出了改进酸洗、磷化、退及变形工艺的方法。
4.for case hardening respective decarbonizing respective bright annealing of long rod,bars and or wire bundles.
适于长条料、棒材或属线包的表面渗碳、脱碳、光亮退。
5.It is established the evaluation method of annealing detergence for copper rolling oil by simulating industrial program with thermogravimetric analyzer.
用热重分析仪模拟工业退程序,建立了铜轧制油退清净性的评价方法。
6.According to the user may also need to reprovision bright annealing line, the pressure of the entire park, and other sewing aids.
还可根据用户需要另配在线光亮退，内园等辅助设施。
7.Also, High electric field annealing of stressed PMOSFET and detrapping of trapped electrons on the gate oxide are studied deeply.
重点研究了退化PMOS器件的高场退效应和氧化层陷阱电子的退陷阱机制。
8.I conclude that the increase of detwinning stress with annealing temperature results from the surface hardening of the sample due to surface oxidation;
由此实验现象可以得出结论，文献报道的去孪晶应力随着退温度升高而升高的现象是由于样品表面氧化造成的。
9.AAO is transforming noncrystal to crystal after annealing in 850℃,1000℃,1160℃.The range of utilization is increasing from the pH 5-10 to 2-13.
10.They include laser doping, laser annealing, laser depositing film, solid-phase reaction induced by laser and laser photolithograph.
这些应用大致涵盖激光掺杂、激光退、激光沉积薄膜、激光引发固相反应和激光光刻等几方面。
11.First, the solid ice on the surface could have been annealed, meaning that its temperature could have been raised above the 78 Kelvin mark to allow the amorphous ice to recrystallize.
首先，表面的固体冰曾经退过，也就是说其温度曾升高至78K以上使无定型冰重新结晶。
12.It was reported that the detwinning stress in martensite of Ti-Ni alloys increases with increasing annealing temperature, but the reason for such a strange behavior has remained unclear.
有报道称Ti-Ni合的去孪晶应力随着退温度的升高而升高，但是造成这一现象的原因并清楚。
13.Welds makes up in the process the substrate not to give off heat, not to distort, the unstressing, does not have the hard spot and the annealing situation.
。
代表本软件的观点；若发现问题，欢迎向我们指正。
属的电阻率和温曲率等主要性能将产生变化。
园等辅助设施。
